Integrated circuit, Hybrid, and multichip module packaye design guidelines: a focus on reliability

Author :

Pecht, Michael

Author Statement :

Michael pecht

Collation :

xiii, 426 P

Addition :

Title :

Integrated circuit, Hybrid, and multichip module packaye design guidelines: a focus on reliability

LC Class :

621

LC Number :

.381046

LC CutterNumber :

P 365 I

Publication Year :

1994

Publication :

John wiley & Sons

Subject :

Electronic packaging- Design,Hybrid in tegrated circuits- Design and construction,Multichip modules design and construction.

DocumentNumber :

30535

ISBNN :

, 1 , 1309 , 3-1

Link To Document :