Author Statement
Michael pecht
Collation
xiii, 426 P
Addition
,
Title
Integrated circuit, Hybrid, and multichip module packaye design guidelines: a focus on reliability
LC Class
621
LC Number
.381046
LC CutterNumber
P 365 I
Publication Year
1994
Publication
John wiley & Sons
Subject
Electronic packaging- Design,Hybrid in tegrated circuits- Design and construction,Multichip modules design and construction.
DocumentNumber
30535
ISBNN
, 1 , 1309 , 3-1
RecordNumber
8465